Xiaomi Reveals XRING 01: All the Facts on Their New Smartphone Chip
Xiaomi has officially announced the XRING 01, a new high-performance processor designed for their smartphones. This is the first time in seven years that Xiaomi has developed such a core smartphone chip in-house.
The announcement was made by Xiaomi CEO Lei Jun on May 16, 2025. This step shows Xiaomi’s strong effort to build more of their own technology and depend less on other companies for key components like processors.
Developing a chip like the XRING 01 is a significant undertaking, and reports indicate it has been a project approximately ten years in the making for Xiaomi. By creating this chip, Xiaomi joins a select group of global technology companies that design the main processors for their own devices.
Why This Chip Matters for Xiaomi
Having their own chip allows Xiaomi several important advantages:
- More Independence: Reduces reliance on external chip suppliers like Qualcomm and MediaTek.
- Improved Performance: Allows for better optimization between the chip’s hardware and Xiaomi’s software, potentially leading to faster and more efficient phones.
- Tailored Technology: Enables Xiaomi to include specific features and capabilities unique to their devices.
- Future Potential: Could benefit other areas of Xiaomi’s business, such as their electric vehicles, by providing a core processing platform.
Key Facts and Figures About the XRING 01
While official detailed specifications are yet to revealed, information circulating since the announcement provides specific facts and figures about the XRING 01 are as follows:
| Feature | Detail |
| Type | High-end smartphone System-on-Chip (SoC) |
| Announcement Date | May 16, 2025 |
| Development Time | Approximately 10 years (reported) |
| Manufacturing | Produced by TSMC. Reports vary on the exact technology used: some state 4nm (specifically N4P), others claim 3nm (specifically N3E). |
| CPU (Processor) | Octa-core setup with a 1+3+4 configuration. |
| High-Performance CPU Core | One Cortex-X925 core, rumored to run at up to 3.2 GHz. |
| Performance CPU Cores | Three Cortex-A725 cores, rumored to run at up to 2.6 GHz. |
| Efficiency CPU Cores | Four Cortex-A520 cores, rumored to run at up to 2.0 GHz. |
| GPU (Graphics) | Rumored to be an Imagination Technologies IMG DXT72. |
| GPU Speed | Rumored to run at up to 1.3 GHz. |
| Performance Expectation | Leaks suggest performance potentially exceeding Qualcomm Snapdragon 8 Gen 3 in some areas, or comparable to Snapdragon 8 Gen 2 or 8 Gen 1. GPU performance potentially exceeding Adreno 740. |
| Other Components | May include a Xiaomi-designed Image Signal Processor (ISP). Modem and DSP potentially from partners. |
| Launch Timeline | Official debut in China by the end of May 2025. |
| First Device | Not yet announced which smartphone model will feature the chip first. |
Note: The exact manufacturing process (4nm or 3nm) is based on different reports, and final confirmation is expected at the official launch.
What’s Next?
The XRING 01 is scheduled to be officially unveiled in more detail in China by the end of May 2025. This upcoming event is expected to provide the complete and confirmed specifications of the chip.
This launch signifies Xiaomi’s strong commitment to advancing its core technology and competing at the highest levels in the global smartphone market. It’s a major step in their strategy to control key aspects of their product development and manufacturing.
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